The Solidification Process Of The Single Crystal Supealloy

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Single crystal supealloy is a Ni-based alloy, and it consists of many elements,including Ni, W, Mo, Al, Ti, Re, etc. Usually, there is some composition segregation and low melting point eutectic formed in the surface of single crystal casting without tin, see Fig.1 (b). However, if the single crystal casting has a tin layer on the casting surface, tin will react with Ni in the interface between single crystal casting and tin layer. The reaction is closely related to the solidification process. When the model shell was immersed in the tin bath, the liquid superalloy was cooled by tin. Because of the contraction of solidified superalloy, gap will be formed between the model shell and solidified superalloy. The liquid tin will penetrate at some …show more content…

The oxide layer plus a reaction layer spalled partly because the stress induced by temperature change, and the other part of the reaction layer was remained after heat treatment, see Fig. 2(c). That is the reason why there is no oxygen in the EDS measurements in points “1”-“5” in Fig. 2(d). The quantity of the IMC layer thickness becomes difficult due to the spalling of the reaction layer. During the heat treatment procedure, Sn gradually diffuses into the surface of Ni based superalloy and the concentration of Sn in Ni superalloy increases. So (+')(Sn) eutectic volume fraction is increased after heat treatment, as shown in Fig. 2(c) and (d). The size and volume fraction of (+')(Sn) eutectic increase apparently because the Sn diffuse into superalloy and enlarge the eutectic solidification range. At the meantime, the recalescence behaviour lead the primary eutectic was halting and fine second eutectic formed, similar to the paper [24]. The reason why the recalescence behaviour took place is as follows: (i) The solidified lateral heat was dissipated into the front of eutectic during solidification and that lead the local temperature increase; (ii) the eutectic liquid was supercooled because it’s low melt point and no nucleate arising; (iii) the solidified rate of second …show more content…

The initial diffusion of Sn may be only taking place on the surface of single crystal superalloy. But as the time increasing Sn may diffuse into the superalloy substrate. Generally, the diffusion behaviour between Sn and Ni affects the microstructure evolution. The atomic mobilities of Sn and Ni in fcc Ni-Sn alloys were assessed as a function of temperature [26]. Besides, the solidified defects can accelerate the diffusion, such as grain boundary and micro porosity. For single crystal superalloy, the typical solidified defect is the micro porosity, which is mainly located in the interdendrite. The micro porosity is easy to observe in XRT micrograph. XRT micrograph of porosities in bulk sample seems in disorder, but in very thin casting the micro porosity is aligned along the interdendrite. Sn atom diffuses into the porosity located in interdendrite easily and enrichment near the porosity during heat treatment. With the diffusion of Sn, (+') (Sn) eutectic will be formed. As a result (+') (Sn) eutectics are near the porosities located in interdendrite region, as shown in Fig.5 (d). However, the distribution of (+') (Sn) eutectic is in disorder, see Fig. 3(c), this is the effect of the large size of bulk casting and observed sample position. During the formation of +' eutectic Sn atoms were rejected into the +' eutectic front end, due to the Sn

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