Conclusion Of Electrodeposition

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In 1830 Michael Faraday predicted a relationship between the charge passed and the amount of a substance oxidized or reduced at an electrode. His proposal was based on two main arguments related to electrolytic processes:
i) The amount of chemical change produced by an electrical current is proportional to the quantity of electricity passed. ii) The amounts of various substances liberated by a given quantity of electricity are inversely proportional to their chemical equivalent weights.
These principles are come to life mathematically as follows:
W = ItA / nF (1.3) where, W - weight of the substance,
A - Atomic or molecular weight,
I - Current,
F - Faraday’s constant, n - Number of valence electrons participating in the reaction, t - Time elapsed.
Thus the electrodeposition is the simplest of the chemical methods, and it has many advantages (Chopra 1969) like
Structurally and compositionally modulated alloys and compounds can be deposited which are not possible with other deposition techniques.
In most of the cases the deposition can be carried out at room temperature enabling to form the semiconductor junctions without inter diffusion. Deposition on complex shapes is possible.
Toxic gaseous precursors need not to be used (unlike gas phase methods). The deposition process can be controlled more accurately and easily
Factors governing electrodeposition
The preparatory parameters directly affect the structural and morphological properties of the electrodeposits. The various preparation parameters like substrate, bath temperature, complexant, applied field and current density, and pH of the bath etc. should be controlled to obtain uniform and smooth deposits (Gaikw...

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...in film research originated from space and defence programmes to which the device cost is less important than its lightweight. The major applications of thin film technology are not now exclusively in these areas but rather often lie in the domestic sector in which low cost is essential (Chopra 1969, West 2003). Thin film materials have already been used in semiconductor devices, integrated circuits, telecommunications, wireless communications, rectifiers, transistors, solar cells, flat-panel displays, photoconductors, light-emitting diodes, light crystal displays, magneto-optic memories, audio and video systems, compact discs, electro-optic coatings, memories, multilayer capacitors, smart windows, computer chips, magneto optic discs, lithography, micro electromechanical systems (MEMS), and multifunctional emerging coatings and other emerging cutting technologies.

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