Experimental Study of Force Convective Heat Transfer of CuO/water Nanofluid in a Microchannel Heat Sink

Experimental Study of Force Convective Heat Transfer of CuO/water Nanofluid in a Microchannel Heat Sink

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Technology progresses in the fields such as: electronic industries, high power engine and optical device that produce high heat flux is in a way that conventional methods are not able to remove the heat generated by these devices and need to advance cooling methods. There are two ways to improve the cooling processes. The first way is design of new cooling device with smaller channel dimensions that causes enhanced convective heat transfer coefficient due to increased fluid velocity [1, 2]. The use of microchannel as a cooling device for dissipating heat from silicon integrated circuit was first proposed by Tuckerman and Pease [3]. Two important goals in the electronics cooling are the reduction of maximum temperature of the device, and minimization of temperature gradients on the device surface that can be achieved by the use of microchannel heat sink (MCHS) [4]. The second way of enhancing cooling process is improving the heat transfer properties of fluids [5-9]. Since the thermal conductivity of metallic solids is much higher than the thermal conductivity of fluids, use of suspended millimeter or micrometer sized metallic solid particles in the fluid is expected to enhance the thermal conductivity of the base fluid [10]. To overcome the problems such as: abrasion, particles sedimentation, clogging, and finally additional pressure drop along the channel that occurs due to the large size of particles, the novel concept of nanofluid was first introduced by Choi and Eastman [11].Several experiments have been carried out to suspend various metal and metal oxide nanoparticles in several different base fluids by Choi and Eastman [7, 12-15].
Considering the importance of MCHS in the cooling processes, numerical and experimental stud...


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...r unless a surfactant used. Selvakumar and Suresh [22] experimentally measured the convective heat transfer coefficient of CuO/water nanofluid in the turbulent flow in an electronic heat sink. They found that the convective heat transfer coefficient of nanofluid increases with increasing flow rate and nanofluid concentration. Maximum increase in the convective heat transfer coefficient was about 29% which was occurred at 2 vol.% of nanofluid. They also proposed a correlation for Nusselt number in the turbulent flow regime in the microchannel.
In this study, local convective heat transfer coefficient and friction factor of CuO/water nanofluid in a rectangular MCHS were experimentally measured in the laminar flow regime. In these experiments, we focused on the effect of flow rate and nanofluid concentration on the heat transfer coefficient in the channel entrance.

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