Analysis Of Magnetron Sputtering

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As mentioned already magnetron sputtering has become the process of choice for deposition of a wide range of industrial coatings. When power is supplied to the magnetron, a negative voltage of typically -300 V or more is applied to the target. This attracts ions to the target surface at speed. When they collide with the surface two important processes take place: atoms are knocked out of the target surface. These sputtered atoms are neutrally charged and so are unaffected by the magnetic trap. These sputtered atoms collide with the substrates to be coated and form an extremely adherent coating. Generally the formation of the coating consists of four-stage process, nucleation, island growth, coalescence and finally continuous growth. The second important process that occurs when an ion collides with the target surface is that electrons are emitted. The light and negatively charged electrons when they leave the surface are affected by the combination of …show more content…

The schematic diagram of a magnetron gun is shown in Figure 11. Magnetron sputtering creates most uniform and most cost effective films. During magnetron sputtering energetic electron escape from the primary magnetic trap between the inner and outer magnets, and in the balanced magnetic field these electrons go to the anode. It is the primary trap that is responsible for the formation of the dense plasma directly in front of the sputtering target. A magnetron consists of a plate of the material of which all or part of the coating is consisting with magnets arranged behind it with alternating polarity. Well defined plasma forms near the surface of the target. Ejected electrons that are able to leave the near cathode region expend their energies locally increasing the probability of ionization near the target and thereby the sputtering rate. This is the result of the E x B

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