Effective Heat Dissipation Techniques in Electronic Devices

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Heat indulgence techniques are the prime concern to remove the waste heat produced by Electronic Devices, to keep them within permitted operating temperature limits. Heat indulgence techniques include heat sinks, fans for air cooling, and other forms of cooling such as liquid cooling. Heat produced by electronic devices and circuitry must be self-indulgent to improve reliability and prevent premature failure. Integrated circuits such as CPUs, chipset, graphic cards, and hard disk drives are susceptible to temporary malfunction or permanent failure if overheated. As a result, efficient cooling of electronic devices remains a challenge in thermal engineering. Heat sinks are commonly used for cooling of electronic devicesHeat sinks, an array of heat fins, remove the heat from the surfaces of the chips by enhancing the heat Transfer rate through heat conduction process. …show more content…

In this present work the CFD simulation of heat sink is carried out for two different velocity magnitudes. The heat sink is modelled as a combination of Copper and Aluminium materials. The base of the heat sink is taken as Copper and the fins are modelled as Aluminium. A conjugate heat transfer analysis is carried out for this fluid – structure case. Two cases are simulated with a velocity of flow as 4 m/s and 10 m/s. The base of the heat sink is given with heat flux boundary. The results of both the scenarios are showing good coherence with the physical phenomenon. As velocity increases the temperature of the heat sink decreases, so the heat generated in the heat sink will become less. The rate of heat transfer will be

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